Advanced Packaging Jobs
Browse 7 exciting jobs hiring in Advanced Packaging now. Check out companies hiring such as Intel, Vinci4d in Chula Vista, Omaha, Santa Rosa.
Intel Foundry Services is hiring a Packaging and Test Account Technical Solutions Engineer to lead customer-facing engagements and ensure successful qualification, ramp and delivery of advanced packaging solutions.
Vinci is hiring a Strategic Account Executive to own and expand relationships at top semiconductor firms, translating the value of its Physics AI platform into multi-million dollar deployments.
Intel is hiring an Advanced Packaging Module Development Engineer to drive process and equipment development at the module level, improving yield, reliability, and manufacturability for advanced packaging technologies.
Intel's APTM team is seeking a Packaging Module Equipment Development Engineer to drive equipment, materials and process development for advanced semiconductor packaging and scale solutions for high-volume foundry production.
Lead cross-site manufacturing quality for advanced packaging and assembly at Intel Foundry, driving supplier programs, 8D-based corrective actions, and world-class quality KPIs across multiple sites.
At Intel Foundry, this Customer Enabling Engineer will lead technical customer engagements for advanced packaging—translating requirements into package architecture, coordinating NPI and schedule, and ensuring successful execution across stakeholders.
Intel Foundry's Advanced Packaging team is hiring a Yield Systems Engineer to build and maintain yield/defect analysis software and data pipelines that accelerate yield learning from development to high-volume manufacturing.
