Ic Packaging Jobs

Lead and grow the Package Design team to deliver HVM-ready IC packaging solutions (FCBGA/FCCSP, multi-die, chiplets) that enable Astera Labs' PCIe, CXL, and Ethernet connectivity products.

A high-ownership technical lead role to design, simulate, layout, and drive first-silicon learning for highly integrated silicon photonic ICs at an early-stage photonics company.

EAG Laboratories is hiring a DPA Engineer to lead destructive physical analysis and reliability investigations on electronic components using SEM/EDS, X-ray, C-SAM and advanced cross-sectioning techniques.