Browse 2 exciting jobs hiring in Icpms now. Check out companies hiring such as Intel in Albuquerque, Tallahassee, Wichita.
Intel is hiring an Advanced Packaging Module Development Engineer to drive process and equipment development at the module level, improving yield, reliability, and manufacturability for advanced packaging technologies.
Experienced packaging R&D engineer needed to develop and scale advanced EMIB substrate technologies in a high-volume foundry environment, with significant hands-on factory and supplier engagement.
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