Packaging Reliability Jobs
Browse 7 exciting jobs hiring in Packaging Reliability now. Check out companies hiring such as Shield AI, Renesas Electronics, Intel in Philadelphia, Buffalo, Houston.
Lead a high-performing mechanical engineering team and contribute technical design and reliability work for ruggedized aerospace systems at a fast-paced, mission-driven deep-tech company.
Lead package design and qualification for advanced power SiP, flip-chip LGA, and multi-chip modules at Renesas, driving process development, supplier qualification, and production ramp for automotive, industrial, and consumer power applications.
Intel is hiring an Advanced Packaging Module Development Engineer to drive process and equipment development at the module level, improving yield, reliability, and manufacturability for advanced packaging technologies.
Lead the development and qualification of space-grade coatings and materials for Starlink satellites, driving solutions from concept through high-volume production.
At Intel Foundry, this Customer Enabling Engineer will lead technical customer engagements for advanced packaging—translating requirements into package architecture, coordinating NPI and schedule, and ensuring successful execution across stakeholders.
EAG Laboratories is hiring a DPA Engineer to lead destructive physical analysis and reliability investigations on electronic components using SEM/EDS, X-ray, C-SAM and advanced cross-sectioning techniques.
Intel Foundry is hiring a Transport Media and Materials Engineer in Phoenix to develop and qualify shipping packaging for semiconductor wafers, components, and system boards while driving cost, quality, and sustainability improvements.
How much do packaging reliability jobs pay?
Below 50k*
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50k-100k*
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Over 100k*
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Top companies hiring for packaging reliability jobs
- Intel 2
Best cities to find packaging reliability jobs
