Browse 6 exciting jobs hiring in Tga now. Check out companies hiring such as Intel, Helion, SpaceX in Oklahoma City, Gilbert, Atlanta.
Intel is hiring an Advanced Packaging Module Development Engineer to drive process and equipment development at the module level, improving yield, reliability, and manufacturability for advanced packaging technologies.
Helion seeks a hands-on Materials Engineer in Everett to run materials characterization and failure-analysis campaigns supporting development of high-reliability electrical insulation and structural components for fusion prototypes.
Lead the development and qualification of space-grade coatings and materials for Starlink satellites, driving solutions from concept through high-volume production.
Materials Engineer for Starlink at SpaceX to develop and qualify polymer materials and processes for high-volume satellite production.
Experienced packaging R&D engineer needed to develop and scale advanced EMIB substrate technologies in a high-volume foundry environment, with significant hands-on factory and supplier engagement.
A postdoctoral researcher is needed at Argonne to develop and electrochemically evaluate next-generation Li- and Na‑ion cathode materials through synthesis, characterization, and scale-up activities.