Osat Jobs

K2 Space is hiring a Principal ASIC Package Design Engineer to lead FC-BGA and MCM package architecture, vendor qualification, and production ramp for high-power satellite ASICs.

K2 Space is hiring a Senior ASIC Package Design Engineer to define and deliver FC-BGA and MCM package architectures for high-pin-count, high-performance ASICs in a Series C space startup.

Lead package design and qualification for advanced power SiP, flip-chip LGA, and multi-chip modules at Renesas, driving process development, supplier qualification, and production ramp for automotive, industrial, and consumer power applications.

Lead and grow the Package Design team to deliver HVM-ready IC packaging solutions (FCBGA/FCCSP, multi-die, chiplets) that enable Astera Labs' PCIe, CXL, and Ethernet connectivity products.

Lead silicon NPI, production ramp and yield optimization at EnCharge AI, driving test development, failure analysis, and vendor coordination to bring cutting-edge in-memory computing products to volume production.