Principal ASIC Package Design Engineer
Skills
- Deep expertise in FC-BGA package design and high-pin-count ASICs
- Experience with MCM / heterogeneous integration (preferred)
- Strong SI/PI fundamentals and PDN design experience
- Thermal management for power-dense packages
- Familiarity with substrate technologies, materials, and assembly processes
- Proficiency with SI/PI and EM simulation tools (e.g., SIWave, HFSS, ADS)
- Experience working directly with OSATs and substrate vendors
- Knowledge of packaging qualification and test methodologies
Responsibilities
- Define and own ASIC package architecture for FC-BGA and MCM solutions including substrate stack-up, ball-map strategy, and mechanical constraints.
- Lead package-level trade studies across cost, performance, SI/PI, thermal, manufacturability, and reliability.
- Drive PDN strategy, signal breakout, escape routing, impedance control, and decoupling plans for high-pin-count devices.
- Develop thermal architecture at the package level including lids, TIMs, heat spreaders, and mechanical interfaces to system cooling.
- Partner with silicon, RF, and systems teams to co-optimize die floorplans and package interfaces.
- Establish organizational package design standards, methodologies, and best practices.
- Act as primary technical interface to substrate vendors, assembly houses, and OSATs and lead material and process selection.
- Lead qualification and manufacturing readiness efforts through production ramp.
Education
- Bachelor’s degree in Packaging Engineering, Electrical Engineering, Mechanical Engineering, or related field (required)
- Master’s or PhD in relevant discipline (preferred)
Benefits
- Base salary range $200,000–$280,000 plus equity
- Comprehensive medical, dental, and vision coverage
- Paid time off and paid parental leave
- Life insurance and other standard benefits
- Equity participation in a high-growth Series C startup
- Opportunities for career growth and impact on first-of-kind satellite platforms
Average salary estimate
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