Browse 6 exciting jobs hiring in Substrate now. Check out companies hiring such as Intel, K2 Space, Renesas Electronics in Honolulu, Cape Coral, Milwaukee.
Intel's Advanced Packaging group is hiring a Yield Engineer On Shift to troubleshoot equipment and process issues, drive yield recovery actions, and support continuous lot flow in a 24x7 manufacturing environment.
K2 Space is hiring a Principal ASIC Package Design Engineer to lead FC-BGA and MCM package architecture, vendor qualification, and production ramp for high-power satellite ASICs.
K2 Space is hiring a Senior ASIC Package Design Engineer to define and deliver FC-BGA and MCM package architectures for high-pin-count, high-performance ASICs in a Series C space startup.
Lead package design and qualification for advanced power SiP, flip-chip LGA, and multi-chip modules at Renesas, driving process development, supplier qualification, and production ramp for automotive, industrial, and consumer power applications.
Experienced packaging R&D engineer needed to develop and scale advanced EMIB substrate technologies in a high-volume foundry environment, with significant hands-on factory and supplier engagement.
Lead and grow the Package Design team to deliver HVM-ready IC packaging solutions (FCBGA/FCCSP, multi-die, chiplets) that enable Astera Labs' PCIe, CXL, and Ethernet connectivity products.
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