Rise Jobs & Careers icon Substrate Jobs

Browse 6 exciting jobs hiring in Substrate now. Check out companies hiring such as Intel, K2 Space, Renesas Electronics in Honolulu, Cape Coral, Milwaukee.

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Intel Hybrid US, Arizona, Phoenix
Posted 2 days ago
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Onsite Gym
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Vision Insurance
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Health Savings Account (HSA)
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Learning & Development
Paid Time-Off
401K Matching
Maternity Leave
Paternity Leave

Intel's Advanced Packaging group is hiring a Yield Engineer On Shift to troubleshoot equipment and process issues, drive yield recovery actions, and support continuous lot flow in a 24x7 manufacturing environment.

Posted 4 days ago

K2 Space is hiring a Principal ASIC Package Design Engineer to lead FC-BGA and MCM package architecture, vendor qualification, and production ramp for high-power satellite ASICs.

Posted 4 days ago

K2 Space is hiring a Senior ASIC Package Design Engineer to define and deliver FC-BGA and MCM package architectures for high-pin-count, high-performance ASICs in a Series C space startup.

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Lead package design and qualification for advanced power SiP, flip-chip LGA, and multi-chip modules at Renesas, driving process development, supplier qualification, and production ramp for automotive, industrial, and consumer power applications.

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Posted 16 days ago
Inclusive & Diverse
Rise from Within
Mission Driven
Diversity of Opinions
Work/Life Harmony
Growth & Learning
Transparent & Candid
Customer-Centric
Snacks
Onsite Gym
Family Coverage (Insurance)
Medical Insurance
Dental Insurance
Vision Insurance
Mental Health Resources
Life insurance
Disability Insurance
Health Savings Account (HSA)
Flexible Spending Account (FSA)
Learning & Development
Paid Time-Off
401K Matching
Maternity Leave
Paternity Leave

Experienced packaging R&D engineer needed to develop and scale advanced EMIB substrate technologies in a high-volume foundry environment, with significant hands-on factory and supplier engagement.

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Astera Labs Hybrid San Jose, California, United States
Posted 19 days ago

Lead and grow the Package Design team to deliver HVM-ready IC packaging solutions (FCBGA/FCCSP, multi-die, chiplets) that enable Astera Labs' PCIe, CXL, and Ethernet connectivity products.

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