Browse 5 exciting jobs hiring in Chiplet now. Check out companies hiring such as K2 Space, Intel, PowerLattice Technologies Inc in Nashville-Davidson, Lincoln, San Antonio.
K2 Space is hiring a Principal ASIC Package Design Engineer to lead FC-BGA and MCM package architecture, vendor qualification, and production ramp for high-power satellite ASICs.
Lead and grow a chiplet verification team at Intel, driving verification strategy and execution for complex ASIC/SoC products using advanced verification methodologies.
Lead the microarchitecture, RTL design, and front-to-back implementation of complex SoC subsystems at a VC-backed semiconductor startup advancing next-generation chiplet solutions.
Lead and grow the Package Design team to deliver HVM-ready IC packaging solutions (FCBGA/FCCSP, multi-die, chiplets) that enable Astera Labs' PCIe, CXL, and Ethernet connectivity products.
Lead Hardware Design Engineer to own end-to-end power delivery hardware architecture and validation for PowerLattice's chiplet-based SoC platforms in Chandler, AZ.
Below 50k*
0
|
50k-100k*
0
|
Over 100k*
5
|