Package Si Jobs

K2 Space is hiring a Principal ASIC Package Design Engineer to lead FC-BGA and MCM package architecture, vendor qualification, and production ramp for high-power satellite ASICs.

K2 Space is hiring a Senior ASIC Package Design Engineer to define and deliver FC-BGA and MCM package architectures for high-pin-count, high-performance ASICs in a Series C space startup.

Tenstorrent is hiring a Signal Integrity Engineer to drive high-speed PCB and package design, simulation, and validation for next-generation AI processors across Santa Clara, Austin, or Toronto.

Lead and grow the Package Design team to deliver HVM-ready IC packaging solutions (FCBGA/FCCSP, multi-die, chiplets) that enable Astera Labs' PCIe, CXL, and Ethernet connectivity products.

Lead Hardware Design Engineer to own end-to-end power delivery hardware architecture and validation for PowerLattice's chiplet-based SoC platforms in Chandler, AZ.