Rise Jobs & Careers icon Packaging Engineer Jobs

Browse 22 exciting jobs hiring in Packaging Engineer now. Check out companies hiring such as Vector Atomic, Intel, David Protein in Little Rock, New York, Detroit.

Vector Atomic Hybrid No location specified
Posted yesterday

Vector Atomic is hiring a hands-on Mechanical Engineer to design and produce opto-mechanical and vacuum hardware for next-generation quantum sensors.

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Intel Foundry Services is hiring a Packaging and Test Account Technical Solutions Engineer to lead customer-facing engagements and ensure successful qualification, ramp and delivery of advanced packaging solutions.

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Intel Hybrid US, Arizona, Phoenix
Posted 2 days ago
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Intel's Advanced Packaging group is hiring a Yield Engineer On Shift to troubleshoot equipment and process issues, drive yield recovery actions, and support continuous lot flow in a 24x7 manufacturing environment.

David Protein Hybrid No location specified
Posted 2 days ago

Packaging Engineer to own packaging execution and continuous improvement across flexible film, cartons, corrugated, and D2C cold-chain formats for a fast-growing CPG food brand.

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Lead the design and implementation of scalable Ads Pricing & Packaging systems at Netflix to maximize inventory yield, product packaging, and monetization across CTV and connected platforms.

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Posted 2 days ago

Lead mechanical architecture and production-ready design of high-performance compute ECUs for Aurora’s autonomous vehicle platform, from concept through validation and mass production.

Posted 4 days ago

K2 Space is hiring a Senior ASIC Package Design Engineer to define and deliver FC-BGA and MCM package architectures for high-pin-count, high-performance ASICs in a Series C space startup.

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Posted 7 days ago

Lead packaging engineering at Elanco's Clinton manufacturing site as the technical owner for packaging materials, equipment, compliance, and continuous improvement.

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Lead a high-performing mechanical engineering team and contribute technical design and reliability work for ruggedized aerospace systems at a fast-paced, mission-driven deep-tech company.

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Intel Hybrid US, Oregon, Hillsboro
Posted 10 days ago
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Lead equipment and process optimization for Intel's 300mm bumping and metalization module to deliver high-confidence, high-volume semiconductor packaging solutions.

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Awesome Motive Hybrid 7580 Golf Channel Drive, Orlando, FL
Posted 13 days ago

VERSANT Media seeks a Senior Software Engineer to build and optimize cloud-native video ingestion, encoding, packaging, and validation services powering high-quality streaming at scale.

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Posted 14 days ago

Lead the design and development of precision space opto-mechanical and electronics-packaged infrared sensors for Anduril's imaging systems in Boulder, driving projects from concept to production.

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Posted 15 days ago
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Intel is hiring an Advanced Packaging Module Development Engineer to drive process and equipment development at the module level, improving yield, reliability, and manufacturability for advanced packaging technologies.

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Lead the development and qualification of space-grade coatings and materials for Starlink satellites, driving solutions from concept through high-volume production.

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Posted 16 days ago
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Intel's APTM team is seeking a Packaging Module Equipment Development Engineer to drive equipment, materials and process development for advanced semiconductor packaging and scale solutions for high-volume foundry production.

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Posted 16 days ago
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Experienced packaging R&D engineer needed to develop and scale advanced EMIB substrate technologies in a high-volume foundry environment, with significant hands-on factory and supplier engagement.

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Posted 17 days ago
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Intel is seeking a Module Development Defect Inspection Engineer to lead defect inspection technology development and manufacturing process optimization for advanced packaging and high-volume production.

Posted 21 days ago

Lead a multidisciplinary engineering team to develop and optimize complex paper-converting machinery, ensuring designs meet performance, manufacturability, and cost objectives.

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Intel Hybrid US, Oregon, Hillsboro
Posted 23 days ago
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At Intel Foundry, this Customer Enabling Engineer will lead technical customer engagements for advanced packaging—translating requirements into package architecture, coordinating NPI and schedule, and ensuring successful execution across stakeholders.

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Posted 28 days ago

Esri is hiring a Build/DevOps Engineer II to own and improve CI pipelines, build systems, and developer tooling that support the company's flagship products.

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Posted 28 days ago
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Intel Foundry is hiring a Transport Media and Materials Engineer in Phoenix to develop and qualify shipping packaging for semiconductor wafers, components, and system boards while driving cost, quality, and sustainability improvements.

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Intel Hybrid US, Oregon, Hillsboro
Posted 29 days ago
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Intel Foundry's Advanced Packaging team is hiring a Yield Systems Engineer to build and maintain yield/defect analysis software and data pipelines that accelerate yield learning from development to high-volume manufacturing.

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